Beacon EmbeddedWorks' Cutting-Edge Kurtz Ersa HR 600/2 BGA System
Revolutionizing the rework process for even the smallest and most densely packed BGA’s in the industry
BGA’s (Ball Grid Arrays) have been a common staple in high-tech electronics manufacturing for years as printed circuit board geometrics shrink, in some instances the size of a thumbnail, and continue to fit more functionality into an ever-decreasing footprint. These BGA components are unique because they have terminal connections underneath the component that cannot be seen or contacted with a soldering iron for solder joint rework. These connection points aren’t soldered to typical tin-plated leads as with most electronic components but to an array of solder balls that reflow to the PCB pads during surface mount production.
Beacon EmbeddedWorks takes full advantage of this technology to design the most feature-dense, small-footprint SOM (System-on-Module) available. By designing and manufacturing BGA’s into our array of products, it’s important to be able to remove and replace these components in the rare case of component failure, or for testing out different processors or memory components for a new design on an existing assembly.
Beacon EmbeddedWorks has updated our capability to rework BGA’s using the latest Kurt Ersa HR 600/2 BGA rework platform. The system has the capability of removing and replacing the ultra-small micro-BGA’s of 1mm x 1mm, as well as the much larger and heavily dense modular BGA’s of 50mm x 50mm size. The vision system also gives the operator the ability to manually line up the grid array for verification with the PCB land patterns using its high-powered placer and component cameras, thus allowing the machine to place it in the precise location. This new Ersa system is more automated and accurate and will allow Beacon EmbeddedWorks to solve customers’ need for reworking ever-decreasing sizes and component density in the case of component failure and testing.
BGA’s have become smaller, with a finer pitch over the years. The standard pitch between BGA ball rows has typically been 1.0 mm, then 0.8 mm, and more recently 0.4 mm. Beacon EmbeddedWorks’ small form-factor and feature-dense SOM product lines, as small as 15mm x 27mm, contain multiple BGA’s.
Unique in the industry, Beacon EmbeddedWorks designs, manufactures, and supports several SOM’s to contain a PoP stack-up (Package on Package) with a 0.4 mm pitch. This stack-up consists of a BGA on top of another BGA. Beacon EmbeddedWorks’ Ersa HR 600/2 rework machine can remove and replace each BGA in the PoP stack up – separately or as a set.
Beacon EmbeddedWorks continues to produce designs to take full advantage of new small-footprint and low-power consumption technology. To do this, Beacon EmbeddedWorks is now working on small pitch BGA’s of 0.3 mm pitch. Ball pitch this small presents many challenges within manufacturing. The Ersa HR 600/2 allows the operator to ensure that the component is placed with a high level of precision using the placement camera. The viewing camera allows the operator to zoom into the row of solder balls, ensuring proper ball collapse, all in real-time.
Beacon EmbeddedWorks’ current production line installs over 60K PoP BGA’s per year. Designing and producing BGA’s of this high volume makes it even more critical to verify the components have been installed correctly. When design changes or rework is necessary, the Ersa HR 600/2 is an excellent tool to make this happen.